Chemtronics - BUSINESS - Semiconductor

Overview

TGV (Through Glass Via) is a next-generation technology in semiconductor packaging,
and it replaces silicon or organic based substrate with glass.

Leveraging our mass production experience in hybrid OLED glass
etching processes, Chemtronics established manufacturing
capabilities for Through-Glass Via (TGV) processes that combine
laser and wet etching techniques.

Chemtronics now has the required core technology, mass
production experience, and site infrastructure approved for
hydrofluoric acid usage, offering a competitive edge in the
development of glass substrates.

Chemtronics is focused on the development of TGV (Through Glass Via) process technology for glass substrates.
In order to strengthen our competitiveness in the glass substrate market, we are pursuing in-house integration of the entire process including
laser processing, wet etching, AOI (Automated Optical Inspection), Cu plating, and CMP (Chemical Mechanical Polishing).
This approach ensures improved process efficiency and stable product quality.

Key Competitive Advantages

Process	Details
Laser Modification	- Precision, high-density via hole formation - Achieved high aspect ratio
Wet Etching	- Control hole shape - Own large-area hydrofluoric acid (HF) and alkaline etching solution - Manage roughness inside holes and on surface of glass - Experience in mass production of thin glass etching and own infrastructure
AOI Inspection	- Own post-processing defect detection and yield management solutions
Cu Plating	- Under development (Achieve void-free plating and strong adhesive properties)
CMP(Metal)	- TTV management - Experience and know-how in CMP processes - Acquired semiconductor company and own CMP facilities

Swipe left and right.

Process

Chemtronics has established an optimized supply chain based on SCM, and by integrating key processes,
we have enhanced production efficiency and quality competitiveness.
Currently, we operate the entire process from laser, wet etching, AOI inspection, Cu plating, to CMP, and
are establishing an integrated system that covers production and delivery of finished products.